JPS6325740Y2 - - Google Patents

Info

Publication number
JPS6325740Y2
JPS6325740Y2 JP1983069672U JP6967283U JPS6325740Y2 JP S6325740 Y2 JPS6325740 Y2 JP S6325740Y2 JP 1983069672 U JP1983069672 U JP 1983069672U JP 6967283 U JP6967283 U JP 6967283U JP S6325740 Y2 JPS6325740 Y2 JP S6325740Y2
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
components
resin material
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983069672U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59176152U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983069672U priority Critical patent/JPS59176152U/ja
Publication of JPS59176152U publication Critical patent/JPS59176152U/ja
Application granted granted Critical
Publication of JPS6325740Y2 publication Critical patent/JPS6325740Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983069672U 1983-05-09 1983-05-09 ハイブリツド集積回路の構造 Granted JPS59176152U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983069672U JPS59176152U (ja) 1983-05-09 1983-05-09 ハイブリツド集積回路の構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983069672U JPS59176152U (ja) 1983-05-09 1983-05-09 ハイブリツド集積回路の構造

Publications (2)

Publication Number Publication Date
JPS59176152U JPS59176152U (ja) 1984-11-24
JPS6325740Y2 true JPS6325740Y2 (en]) 1988-07-13

Family

ID=30199825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983069672U Granted JPS59176152U (ja) 1983-05-09 1983-05-09 ハイブリツド集積回路の構造

Country Status (1)

Country Link
JP (1) JPS59176152U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013239496A (ja) * 2012-05-11 2013-11-28 Sanyo Denki Co Ltd 発熱体冷却用容器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013239496A (ja) * 2012-05-11 2013-11-28 Sanyo Denki Co Ltd 発熱体冷却用容器

Also Published As

Publication number Publication date
JPS59176152U (ja) 1984-11-24

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